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晶圆级扇入封装

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  • WLCSP Structure

    • 1M，Ball on Pad

    • 1P1M，Ball on Pad w/ PI

    • 2P1M，Ball on RDL w/o UBM

    • 2P2M，Ball on RDL w/ UBM

  • Process Capabilities

    • WLCSP (8”and 12”)

    • Max. Die Size: 6x6mm

    • Wafer Thickness: 12”, Min.300μm

    • Dielectric Material: PI/PBO

    • UBM:  Ti/Cu/Ni, Plated Cu

    • RDL Line/Space: min. 10um/10um

    • WLCSP Ball Pitch: 0.40mm or 0.50mm


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