晶圆级扇出封装
# | Item | Capability/Spec | Comment |
1 | Incoming Si wafer size | 6”, 8”, 12” | |
2 | Si wafer grinding Thk | ≥150um | W/O Pillar |
3 | PnP die size range | 1.0 x1.0mm~ 8.0x8.0mm | |
4 | PnP passives size range | 0402, 0603 | |
5 | Molding Thk range | 0.5~ 1.0mm | |
6 | RDL L/S | 10/10um | |
7 | RDL Layer | 2 layers | |
8 | BGA size | 200um |